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The solder paste aperture of Heatsink/Earthpads underneath QFN/DFN/SOIC etc. packages should be adjusted to a “window pane” design for reliable soldering. This allows for flux fumes to escape more easily and prevents the building of a large solder blob that may shift the part out of position. #aisler_tips #aisler #electronics #pcb
Its #jellybean_monday again 🥳 Today: Temperature sensors, which are pin compatible with the legendary LM75 (some even software compatible) but offer higher accuracy.