Drill report for Spikeling_ESP32.kicad_pcb
Created on 2025-01-13T19:27:03+0000

Copper Layer Stackup:
    =============================================================
    L1 :  F.Cu                      front
    L2 :  B.Cu                      back


Drill file 'Spikeling_ESP32.drl' contains
    plated through holes:
    =============================================================
    T1  0.400mm  0.0157"  (30 holes)
    T2  0.600mm  0.0236"  (2 holes)
    T3  0.750mm  0.0295"  (20 holes)  (with 20 slots)
    T4  0.800mm  0.0315"  (18 holes)
    T5  0.900mm  0.0354"  (30 holes)
    T6  1.000mm  0.0394"  (23 holes)
    T7  1.040mm  0.0409"  (38 holes)
    T8  1.100mm  0.0433"  (4 holes)
    T9  1.800mm  0.0709"  (14 holes)  (with 14 slots)
    T10  3.200mm  0.1260"  (4 holes)

    Total plated holes count 183


Not plated through holes are merged with plated holes
    unplated through holes:
    =============================================================

    Total unplated holes count 0
